ICs And Semiconductors SMD
1724 footprints
ADVANSID_ASD-RGB1.5S-P-8X8A
8x8 Monolithic Array of 1.5x1.5 mm2 SiPMs (Silicon PhotoMultiplier), Body 14.05 x 14.05x 2.7mm
AEROFLEX_RHD5920
Hermetic Ceramic SOIC, 1.27mm Pitch; 24 Pin, 7.62mm W X 15.59mm L X 3.048mm H Body
ALLEGRO_LZ
ALLGRO MICROSYSTEMS Package LZ,Custom 6-Pin Soic Package
ALPHA_AON21307
SON, 0.65mm, Pitch; 6 Pin,2.00mm W X 2.00mm L X 0.80mm H body (W/Thermal Tab 1.1mm X 1.7mm), IPC Medium Density
ALPHA_AON2409
SON, 0.65mm, Pitch; 6 Pin,2.00mm W X 2.00mm L X 0.80mm H body (W/Thermal Tab 1.1mm X 1.7mm), IPC Medium Density
ANALOG-DEVICES_CC-10-10
LGA, 0.50mm pitch, 14 Pin, 3.00mm L X 5.00mm W X 1.00mm H body, ANALOG DEVICE CC-14-1
ANALOG-DEVICES_CC-14-1
LGA, 0.50mm pitch, 14 Pin, 3.00mm L X 5.00mm W X 1.00mm H body, ANALOG DEVICE CC-14-1
ANALOG-DEVICES_CC-48-10
LGA, 0.50mm Pitch, 48 Pin, 7.00mm L X 7.00mm W X 1.35mm H body (4X w/Thermal Tab 2.38 X 2.38mm)
ANALOG-DEVICES_CP-16-19
QFN, 0.65mm Pitch, Square; 16 Pin, 4.00mm L X 4.00mm W X 0.80mm H Body, IPC Medium Density
ANALOG-DEVICES_DC-4
DFN, 0.50mm Pitch, 3 Pin, 2.00mm L X 2.00mm W X 0.80mm H body (w/Thermal Tab 1.05 X 1.40mm), ANALOG DEVICE DC
ANALOG-DEVICES_DC-8_(05-08-1957)
SON, 0.50mm Pitch; 8 Pin, 2.00mm W X 2.00mm L X 0.80mm H body (w/Thermal Tab 0.30 X 1.65mm)
ANALOG-DEVICES_DFN(22)# 05-08-7071
DFN, 0.5mm Pitch; 22 Pin, 3.00mm W X 6.00mm L X 0.80mm H body (w/x2 Thermal Tab 1.70 X 2.45 mm)
ANALOG-DEVICES_LCC(E-8-1)
Analog Devices package LCC, pitch 0.5mm, 8 pin, 5mm W X 5mm L X 1.55mm H body, IPC Medium Density
ANALOG-DEVICES_LCC(E-8-2)
Analog Devices package LCC, pitch 0.5mm, 8 pin, 5mm W X 5mm L X 1.55mm H body, IPC Medium Density
ANALOG-DEVICES_LFCSP(CP-15-1)
LQFN, 16-Lead, 0.50mm Pitch; 3.50mm W X 3.50mm L X 0.83mm H body (with 4 Tab 0.375 X0.375mm and with a Thermal Tab 1.43 X1.43mm)# 05-08-1798
ANALOG-DEVICES_LQFN(16) # 05-08-1798
LQFN, 16-Lead, 0.50mm Pitch; 3.50mm W X 3.50mm L X 0.83mm H body (with 4 Tab 0.375 X0.375mm and with a Thermal Tab 1.43 X1.43mm)# 05-08-1798
ANALOG-DEVICES_LQFN(20)# 05-08-1689
TSSOP, 16-Lead, 0.65mm Pitch; 6.40mm W X 5.00mm L X 1.10mm H body ( Tab 3.00 X4.70mm and with a Thermal Tab 6.40 X 5.00mm)# 05-08-1663
ANALOG-DEVICES_LQFN(22)# 05-08-7054
TSSOP, 16-Lead, 0.65mm Pitch; 6.40mm W X 5.00mm L X 1.10mm H body ( Tab 3.00 X4.70mm and with a Thermal Tab 6.40 X 5.00mm)# 05-08-1663
ANALOG-DEVICES_LQFN(36)# 05-08-1525
DFN, 0.5mm Pitch; 42 Pin, 4.00mm W X 7.00mm L X 1.03mm H body (with 6 Thermal Tab 1.1 X1.67mm)
ANALOG-DEVICES_MSE16(12)
LQFN, 16-Lead, 0.50mm Pitch; 3.50mm W X 3.50mm L X 0.83mm H body (with 4 Tab 0.375 X0.375mm and with a Thermal Tab 1.43 X1.43mm)# 05-08-1798
ANALOG-DEVICES_SOT-89(RK-3)
SOT89, 1.50mm Pitch; 3-Leads, 2.5mm W X 4.5mm L X 1.6mm H body
ANALOG-DEVICES_TSSOP(16)# 05-08-1663
TSSOP, 16-Lead, 0.65mm Pitch; 6.40mm W X 5.00mm L X 1.10mm H body ( Tab 3.00 X4.70mm and with a Thermal Tab 6.40 X 5.00mm)# 05-08-1663
ANALOG-DEVICES_UDB
QFN, 0.5mm Pitch, 10 Pin, 3.00mm L X 2.00mm W
ANAREN_D10AA30Z4
ANAREN D10AA30Z4, 4 Pin Attenuator, Size 2010, 5.08mm L x W 2.54mm W x 0.635mm H body
ANAREN_D10AAxxZ4
ANAREN D10AAxxZ4, 3 Pin Attenuator, Size 2010, 5.08mm L x W 2.54mm W x 0.635mm H body
ARRAYJ-60035-64P-PCB
64 Channels Silicon PhotoMultiplier (SiPM) High Fill-Factor Array, 50.44mm W x 50.44mm L x 12.47mm H body
ASAT_LPCC-28
QFN, 0.50mm Pitch, Square; 28 Pin, 5.00mm L X 5.00mm W X 1.0mm H Body (w/thermal tab 3.8 X 3.8mm)
ASENSOR_HE144SH
HE144 Series Analog Hall Sensor, Body 3mm x 3mm x 0.5mm
ATCERAMICS_AT0603
ATCERAMICS AT0603, 4 Pin Attenuator, Size 0603, Body 1.60mm L x 0.78mm W X 0.53mm H
ATMEL_8CN3-CASON
ATMEL 8CN3 Case, SON, 1.27mm Pitch; 8 Pin, 8.00mm W X 6.00mm L X 1.00mm H body
ATMEL_TLLGA-48 (ULGA AA 48)
QFN,0.40mm pitch,square;48 pin,5.50mm L X 5.50mm W X 0.60mm H body (w/pullback leads,thermal tab 4.5 X 4.5mm), IPC Medium Density
AVAGO_ACPL-C87B
8-Leads Stretched Surface Mount SO Package, Body 6.807x5.859mm, Pitch 1.27mm
AVAGO_HCNR200-300E
DIP Gull Wing Surface Mount, 8-Leads, Body 11.15x9mm, Pitch 2.54mm
AVAGO_HCNW-300E
SOIC, 2.54mm Pitch; 8 Pin, 9.00mm W X 11.23mm L X 4.00mm H body, AVAGO Package With Gull Wing Surface Mount
AVAGO_HCPL-2232-300E
SOIC, 2.54mm Pitch, 8 Pin, Body 6.35mm W X 9.65mm L X 4.45mm H, AVAGO 8-pin DIP Package With Gull Wing Surface Mount Option 300
AVAGO_HCPL-2601-300E
SOIC, 2.54mm Pitch, 8 Pin, Body 6.35mm W X 9.65mm L X 4.45mm H, AVAGO 8-pin DIP Package With Gull Wing Surface Mount Option 300
AVAGO_HCPL-315J
SOIC 12 Pin of 16, Pitch 1.27mm - Body 7.493x10.312mm, BROADCOM HCPL-315J
AVAGO_HCPL-4503-300E
SOIC, 2.54mm Pitch, 8 Pin, Body 6.35mm W X 9.65mm L X 4.45mm H, AVAGO 8-pin DIP Package With Gull Wing Surface Mount Option 300
AVAGO_HCPL-4504-300E
SOIC, 2.54mm Pitch, 8 Pin, Body 6.35mm W X 9.65mm L X 4.45mm H, AVAGO 8-pin DIP Package With Gull Wing Surface Mount Option 300
AVAGO_SO5
6-Leads Stretched Surface Mount SO Package, Pitch 1.27mm, Body 4.4x3.6mm, Pitch 1.27mm
AVX_SMB (D0-214AA)
AVX SMB DO-214-AA Lead-less Chip Form, 2-Leads, Body 5.2x3.6mm
BOSCH_BME280
BOSCH Case for BME280, 8 Pin, Pitch 0.65mm, Body 2.5 x 2.5mm
BOSCH_BME680
BOSCH Case for BME280, 8 Pin, Pitch 0.8mm, Body 3 x 3mm
BOSCH_BMI088
BOSCH-BMI088 Case, 16 Pin, 4.50mm W X 3.00mm L X 1.00mm H body
BOURNS_CDDFN10-0506N
BOURNS DFN10, TVS Diode, 0.80mm Pitch; 10 Pin, 2.00mm W X 4.00mm L X 0.55mm H body (w/Thermal Tab 0.90 X 1.50mm)
BOURNS_TBU-CA
DFN, 3-Leads, Body 6.5 x 4mm, BOURNS TBU-CA Series
BROADCOM_ACPL-M484
SO-5, 1.27mm Pitch; 5 Pin,7.00mm W X3.6mm L X 2.5mm H body, BROADCOM ACPL-M484
BROADCOM_ACPL-P347
SOIC, 1.27mm Pitch; 6 Pin, 6.81mm W X4.58mm L X 3.307mm H Body, BROADCOM ACPL-P347
BROADCOM_AFBR-FS50B00
SOIC, 1.27mm Pitch; 6 Pin, 6.81mm W X4.58mm L X 3.307mm H Body, BROADCOM ACPL-P347
BROADCOM_AFBR-S4N44P164M
3.84X3.74mm, 4×4 NUV-MT Silicon Photomultiplier Array, Body 16 x 16 x 1.23mm
CERN_FEAST2.1
QFN, 0.50mm Pitch, Square; 32 Pin, 5.00mm L X 5.00mm W X 0.90mm H body (w/Thermal Tab 3.60 X 3.60mm)
CERN_NINO2-ALICE-TOF
TAPP Case 5mm X 7mm X 0.8mm H
CERN_aCCURATE_JLCC28
PLCC, 1.27mm Pitch, Square; 7 Pin X 7 Pin, 11.50mm L X 11.50mm W X 4.57mm H body, IPC Medium Density
CERN_bPOL12V
QFN, 0.50mm Pitch, Square; 32 Pin, 5.00mm L X 5.00mm W X 0.90mm H body (w/Thermal Tab 3.60 X 3.60mm)
CLARE_LCA701S
SOIC, 2.54mm, Pitch; 6 Pin, 6.35mm W X 8.382mm L X 4.699mm H body, CLARE LCA701S Serie
CLARE_LCA717S
SOIC, 2.54mm, Pitch; 6 Pin, 6.35mm W X 8.382mm L X 4.699mm H body, CLARE LCA717S Serie
COTO_CT05-3050-J1
DO-214-AB/SMC Molded Diode, Body 7.95x2.62mm
CYPRESS_001-67583
36-pin Ceramic Flat Pack (Solder Seal Lid) Package Outline 001-67583, Body 12.19mm X 23.37mm X 2.99mm H
DC-DC_LAMBDA_CCG3-xx-xxDR
TDK, CCG Series, Isolated DC-DC Converter, Body 15.7x10.4mm
DCDC-TRACO_TES2N
TES 2 Series, DC/DC Converter, Body 24x13.7mm
DCDC_LAMBDA_ICG12006A007V-003-R
TDK-Lambda, ICG Series, Isolated DC-DC Converter, Body 12.2x12.2mm
DCDC_MURATA_LXDC2UR
LGA, 9-Pin, Body 2.3mm x2.5mm, MURATA LXDC2UR Series
DCDC_MURATA_LXDC2XQ
LGA, 9-Pin, Body 2.8mm x 2.6mm, MURATA LXDC2XQ Series
DCDC_MURATA_LXDC3EP-F
LGA, 9-Pin, Body 3.2mm x 3.5mm, MURATA LXDC3EP Type F Series
DCDC_MURATA_LXDC55K
LGA, 14-Pin, Body 5.0mm x 5.7mm, MURATA LXDC55K Series
DCDC_MURATA_MTU1
MTU1 Series, Body 8.2 x 8.4, Height 8.5mm
DCDC_MURATA_MTU2
MTU2 Series, Body 8.2 x 8.4, Height 8.5mm
DCDC_MURATA_MYMGK
LGA, 23-Pin, Body 7.5mm x 9.0mm, MURATA MYMGK Series
DCDC_MURATA_NTE
SOIC, 2.54mm,pitch; 8 pin, 7.70mm W X 12.70mm L X 6.60mm H body, IPC Medium Density
DCDC_MURATA_OKL-T/1-W12
OKL-T/1-W12 Series, Body 12.4x12.4mm, 4.6mm
DCDC_MURATA_OKL2-T/20-W12
MURATA OKL2-T/20-W12 Series, 10 Pin Land Grid Array 100W DC-DC Converter, Body 13.46 x 33.02mm
DCDC_PICO_SMV
SMV Series, SMD DC/DC Converter, Body 12.7x12.7mm
DCDC_RECOM_R2D
R2D Series 6 Pin of 10 SMD Package Version, DC/DC Converter, Body 10.7X15.24mm
DCDC_TDK-LAMBDA_IBH12020A007V
TDK, iBH Series, Non-Isolated DC-DC Converter, Body 20.3x11.4mm
DCDC_TRACO_TDN1WISM
TDN 1WISM Series , Body 13.2x9.1mm
DCDC_TRACO_TDN5WISM
TDN 5WISM Series , Body 13.2x9.1mm
DCDC_TRACO_TDR2SM
TDR 2SM Series, SMD DC/DC Converter, Body 18.9x12.8mm
DCDC_TRACO_TES1-XX1X
TES 1 Series, Single Output DC/DC Converter, Body 13.7x8mm
DCDC_TRACO_TES1-XX2X
TES 1 Series Dual Output, DC/DC Converter, Body 11x13.7mm
DCDC_TRACO_TES3WI
TES 3 WI Series, 2.54mm Pitch, 12 Pin of 24, Boby 14.8 W X 32.3mm L X 10.45mm H
DCDC_TRACO_TES5WI
TES 5 Series, DC/DC Converter, Body 33.4 x 20.8mm
DCDC_TRACO_THL3WISM
THL 3 WISM Series, DC/DC Converter, Body 24x13.7mm
DCDC_TRACO_TIM 2SM
TSRN-1SM Case, 7-Pin, Pitch 2.54mm, Body 24.05x14.35mm
DCDC_TRACO_TIM 3.5SM
TSRN-1SM Case, 7-Pin, Pitch 2.54mm, Body 24.05x14.35mm
DCDC_TRACO_TMR2WISM
TMR 2WISM Series, DC/DC Converter, Body 19x14.9mm
DCDC_TRACO_TRN1SM-Single
TRN 1 SM Series, DC/DC Converter, Body 12.1 x 11.9 x 7.6mm
DCDC_TRACO_TRN1SM
TRN 1 SM Series, DC/DC Converter, Body 12.1 x 11.9 x 7.6mm
DCDC_TRACO_TSR0.5SM
TSRN 0.5SM Series, Case, 10 Pin, Pitch 2.54mm, Body 9.6 x 15.3mm
DCDC_TRACO_TSR1SM
TSR 1 SM Series, DC/DC Converter, Body 15.24 x 11.8 x 7.62mm
DCDC_XPPOWER_AG0-2KV
AG Series, DC/HVDC Converter, Body W 11.43mm x L 23.37mm x H 6.35mm
DFN100X60X40-2N
DFN; 2 pin,1.00mm L X 0.60mm W X 0.40mm H, IPC Medium Density
DFN100X60X40-3N
DFN; 2 pin,1.00mm L X 0.60mm W X 0.40mm H, IPC Medium Density
DFN100X60X50-2N
DFN; 2 pin,1.00mm L X 0.60mm W X 0.50mm H, IPC Medium Density
DFN160X100X60-2N
DFN; 2 Pin, 1.60mm L X 1.00mm W X 0.60mm H, IPC Medium Density
DFN170X90X85-2N
DFN; 2 Pin,1.70mm L X 0.90mm W X 0.85mm H, IPC Medium Density
DFN310X150X55-2N
DFN; 2 Pin,3.10mm L X 1.50mm W X 0.40mm H, IPC Medium Density
DFN50P300X200X100-9N-R175X155
DFN, 0.5mm Pitch, 8 Pin, 3.00mm W X 2.00mm L X 1.00mm H Body (w/Thermal Tab 1.75 X 1.55mm), IPC Medium Density
DFN50P300X200X100-9N-S160
DFN, 0.5mm Pitch, 8 Pin, 3.00mm W X 2.00mm L X 1.00mm H Body (w/Thermal Tab 1.75 X 1.55mm), IPC Medium Density
DICONEX_46-H0635
DICONEX, 3 Pin SMD Attenuator, L 6.35 x W 6.35 x H 0.635mm
DIODES-INC_POWER-DI5060-8
SOIC, 1.27mm Pitch, 8 Pin, Body 5.89mm W X 4.9mm L X 1.12mm H, PowerPAK® SO-8, (SINGLE)
DIODES-INC_POWERDI 5
2.28mm pitch; 3 pin, 5.375mm L X 3.975mm W X 1.150mm H body, POWERDI 5
DIODES-INC_POWERDI123
SODFL Diode; 2.8mm W X 1.78mm L X mm H Body, POWERDI®123 Case
DIODES-INC_TO-252-3L
DPAK TO-252, 2.28mm pitch; 2 pin, 9.7mm L X 6.7mm W X 2.40mm H body
DIODES-INC_U-DFN2030-6
DIODE_U-DFN2030-6, 5-Leads, Body 3.0x2.0mm, Pitch 0.5mm (w/Thermal Tab 1.8 X1.6mm)
DIODES-INC_ZL32
QFN, 0.40mm Pitch, 32 Pin, 3.00mm L X 6.00mm W X 0.80mm H body (w/Thermal Tab 1.5 X 3.5mm)
DIOM2012X160N
SOD110 Diode, Molded Body; 2.00mm L X 1.25mm W, IPC Medium Density
DIOM5026X235N
DO-214-AC/SMA Molded Diode, Body 5.0x2.7mm, IPC Medium Density
DIOM5027X244N
DO-214-AC/SMA Molded Diode, Body 5.0x2.7mm, IPC Medium Density
DIOM5126X265N
DO-214-AC/SMA Molded Diode, 2-Leads, Body 5.1x2.6mm, IPC Medium Density
DIOM5127X229N
DO-214-AC/SMA Diode, Molded Body; 5.10mm L X 2.67mm W X 2.29mm H, IPC Medium Density
DIOM5226X220N
DO-214-AC/SMA Diode, Molded Body; 5.21mm L X 2.60mm W X 2.20mm H, IPC Medium Density
DIOM5226X230N
DO-214-AC/SMA Diode, Molded Body; 5.195mm L X 2.605mm W X 2.30mm H, IPC Medium Density
DIOM5226X243N
Diode, Molded Body; 5.21mm L X 2.605mm W X 2.43mm H
DIOM5226X256N
DO-214-AC/SMA Molded Diode, Body 5.2x2.6mm, IPC Medium Density
DIOM5226X262N
DO-214-AC/SMA Diode, Molded Body; 5.21mm L X 2.605mm W X 2.62mm H, IPC Medium Density
DIOM5226X264N
DO-214-AC/SMA Diode, Molded Body; 5.195mm L X 2.585mm W X 2.64mm H, IPC Medium Density
DIOM5227X270N
DO-214-AC/SMA Diode, Molded Body;5.20mm L X 2.725mm W X 2.70mm H, IPC Medium Density
DIOM5326X230N
DO-214-AC/SMA Molded Diode, Body 5.3x2.6mm, IPC Medium Density
DIOM5336X240N
DO-214-AA/SMB Molded Diode, 2-Leads, Body 5.3x3.6mm, IPC Medium Density
DIOM5336X244N
DO-214-AA/SMB Molded Diode, 2-Leads, Body 5.3x3.6mm, IPC Medium Density