← Footprints
Heatsink_AAVID_Extruded_531002B02100G_34.9x12.7mm_H25.4mm
Extruded 5310, dual radial board level heatsink, TO‐202, TO‐220, 25.4mm height, 2.46mm dia. pins, https://info.boydcorp.com/hubfs/Thermal/Air-Cooling/Boyd-Board-Level-Cooling-Extruded-5310.pdf
Pad Layout
1
1
Pads (2)
| Number | Type |
|---|---|
| 1 | thru hole |
| 1 | thru hole |