← Footprints
LFCSP-16-1EP_3x3mm_P0.5mm_EP1.854x1.854mm
16-Lead Lead Frame Chip Scale Package, 3x3mm, 0.5mm pitch, 1.854mm thermal pad (CP-16-22, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_16_22.pdf)
Pad Layout
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Pads (21)
| Number | Type |
|---|---|
| smd | |
| smd | |
| smd | |
| smd | |
| 1 | smd |
| 2 | smd |
| 3 | smd |
| 4 | smd |
| 5 | smd |
| 6 | smd |
| 7 | smd |
| 8 | smd |
| 9 | smd |
| 10 | smd |
| 11 | smd |
| 12 | smd |
| 13 | smd |
| 14 | smd |
| 15 | smd |
| 16 | smd |
| 17 | smd |