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Nexperia_WLCSP-15_2.37x1.17mm_Layout6x3_P0.4mmP0.8mm
Nexperia wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://assets.nexperia.com/documents/data-sheet/PCMFXUSB3S_SER.pdf
Pad Layout
A1
A2
A3
A4
A5
A6
B1
B2
B3
C1
C2
C3
C4
C5
C6
Pads (15)
| Number | Type |
|---|---|
| A1 | smd |
| A2 | smd |
| A3 | smd |
| A4 | smd |
| A5 | smd |
| A6 | smd |
| B1 | smd |
| B2 | smd |
| B3 | smd |
| C1 | smd |
| C2 | smd |
| C3 | smd |
| C4 | smd |
| C5 | smd |
| C6 | smd |