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OnSemi_ODCSP8_BGA-8_3.16x3.16mm_Layout3x3_P1.26mm
OnSemi ODCSP8 (Case 570CS), 0.27mm pad, 3.16x3.16mm, 8 Ball, 3x3 Layout, 1.26mm Pitch, https://www.onsemi.com/pub/Collateral/570CS.PDF
Pad Layout
A1
A2
A3
B1
B3
C1
C2
C3
Pads (8)
| Number | Type |
|---|---|
| A1 | smd |
| A2 | smd |
| A3 | smd |
| B1 | smd |
| B3 | smd |
| C1 | smd |
| C2 | smd |
| C3 | smd |