← Footprints
MTG270_500_NPTH_8FCVIAS_BOTSM
Unplated Through Hole: Hole Dia.=2.7mm Pad Dia.=5.0mm with 8 vias filled and capped and soldermask on Bottom.
Pad Layout
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Pads (9)
| Number | Type |
|---|---|
| 1 | thru hole |
| 1 | thru hole |
| 1 | thru hole |
| 1 | thru hole |
| 1 | thru hole |
| 1 | thru hole |
| 1 | thru hole |
| 1 | thru hole |
| 1 | thru hole |