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ICs And Semiconductors BONDING
22 footprints
ALBIS_PD10F1-T7W
Fiber Optic Photodiode Detector, Anode and Cathode Wire Bonding on Front Side
ICs And Semiconductors BONDING3 pads
CERN_ACCURATE3
Wire Bonding Chip, Body 1.92x1.832mm
ICs And Semiconductors BONDING114 pads
CERN_ACCURATE_2A
Wire Bonding Chip, Body 1.473x1.323mm
ICs And Semiconductors BONDING78 pads
CERN_FBCM2023
Bonding, Body 3.00x3.00mm
ICs And Semiconductors BONDING86 pads
CERN_FBCM2023_REDUCED
Bonding, Body 3.00x3.00mm
ICs And Semiconductors BONDING24 pads
CERN_FBCM2023_REDUCED_NOBONDING
Bonding, Body 3.00x3.00mm
ICs And Semiconductors BONDING24 pads
CERN_GBTIA
ICs And Semiconductors BONDING30 pads
CERN_LDQ10
Quad Laser Diode Driver
ICs And Semiconductors BONDING111 pads
CERN_Malta_V0
ICs And Semiconductors BONDING739 pads
CERN_Malta_V2
ICs And Semiconductors BONDING473 pads
CERN_MiniMalta
ICs And Semiconductors BONDING0 pads
CERN_MiniMalta3
ICs And Semiconductors BONDING240 pads
CERN_TC956_0
Wire Bonding Chip, Body 1.4mm x 1.2mm
ICs And Semiconductors BONDING17 pads
CERN_TE301_Z
Wire Bonding Chip, Body 1.4mm x 1.2mm
ICs And Semiconductors BONDING19 pads
CERN_UTOPIA2
Bonding, Body 2.75x2.75mm
ICs And Semiconductors BONDING157 pads
CERN_aCCURATE
Wire Bonding Chip, Body 66um x 490um
ICs And Semiconductors BONDING54 pads
CERN_aCCURATE1
Wire Bonding Chip, Body 1.47x1.32mm
ICs And Semiconductors BONDING78 pads
CERN_aCCURATE2
Wire Bonding Chip, Body 1.92x1.832mm
ICs And Semiconductors BONDING114 pads
EPFL_OSCAM2
Bonding Chip, Body 1.66x1.64mm
ICs And Semiconductors BONDING48 pads
II-VI_APA4401040001
4x Fiber Optic Surface-Emitting Laser, Anode and Cathode Wire Bonding on Top Side
ICs And Semiconductors BONDING13 pads
PHILIPS_ULM850-14-TT-N0104U
4x Fiber Optic Surface-Emitting Laser, Anode and Cathode Wire Bonding on Top Side
ICs And Semiconductors BONDING9 pads
PHILIPS_ULMPIN-14-TT-N0101U
Fiber Optic Photodiode Detector, Anode and Cathode Wire Bonding on Front Side
ICs And Semiconductors BONDING3 pads