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ICs And Semiconductors BONDING
22 footprints
ALBIS_PD10F1-T7W
Fiber Optic Photodiode Detector, Anode and Cathode Wire Bonding on Front Side
CERN_ACCURATE3
Wire Bonding Chip, Body 1.92x1.832mm
CERN_ACCURATE_2A
Wire Bonding Chip, Body 1.473x1.323mm
CERN_FBCM2023
Bonding, Body 3.00x3.00mm
CERN_FBCM2023_REDUCED
Bonding, Body 3.00x3.00mm
CERN_FBCM2023_REDUCED_NOBONDING
Bonding, Body 3.00x3.00mm
CERN_GBTIA
CERN_LDQ10
Quad Laser Diode Driver
CERN_Malta_V0
CERN_Malta_V2
CERN_MiniMalta
CERN_MiniMalta3
CERN_TC956_0
Wire Bonding Chip, Body 1.4mm x 1.2mm
CERN_TE301_Z
Wire Bonding Chip, Body 1.4mm x 1.2mm
CERN_UTOPIA2
Bonding, Body 2.75x2.75mm
CERN_aCCURATE
Wire Bonding Chip, Body 66um x 490um
CERN_aCCURATE1
Wire Bonding Chip, Body 1.47x1.32mm
CERN_aCCURATE2
Wire Bonding Chip, Body 1.92x1.832mm
EPFL_OSCAM2
Bonding Chip, Body 1.66x1.64mm
II-VI_APA4401040001
4x Fiber Optic Surface-Emitting Laser, Anode and Cathode Wire Bonding on Top Side
PHILIPS_ULM850-14-TT-N0104U
4x Fiber Optic Surface-Emitting Laser, Anode and Cathode Wire Bonding on Top Side
PHILIPS_ULMPIN-14-TT-N0101U
Fiber Optic Photodiode Detector, Anode and Cathode Wire Bonding on Front Side